IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544975
8 I-CONNECT007 MAGAZINE I MAY 2026 S ignal integrity and additive manufacturing, par- ticularly in metallization, are defining themes in modern PCB design and fabrication. PCB lay- outs are meticulously engineered systems designed to meet strict electrical and power performance targets. However, achieving those targets does not end at the design stage. Once a design enters fabrication, metallization processes—the precise plating of conductive traces—play a critical role in ensuring that signal speed, reliability, and integrity are achieved in the final physical board. As increasingly smaller electronic devices be- come more complex and performant, maintaining signal integrity becomes significantly more chal- lenging. Higher data rates, tighter geometries, and denser routing all introduce new risks, from imped- ance mismatches to electromagnetic interference. The industry is increasingly turning to modified semi-additive processing (mSAP) and semi-additive processing (SAP) to address these challenges, as these advanced approaches allow for finer feature definition, improved line-edge precision, and tighter tolerances than traditional subtractive methods. The result is better control over electrical performance and a pathway to supporting next- generation applications. At the same time, these technologies represent a fundamental shift for PCB fabricators because they require new materials, processes, and ways of thinking about production. This issue of I-Connect007 Magazine explores these developments in depth, beginning with contributions from PCB007 authors focused on additive technologies. Columnist Don Ball provides a foundational overview, starting with conventional electroplating methods and progressing through mSAP and SAP processes. He examines how these approaches influence etching performance and highlights which techniques have proven effective and which have not. Expanding on the chemistry of metallization, Melbs LeMieux of BY M A RCY L A RO N T, I - C O N N ECT 0 07 Additive Processes, Signal Consequences M A RCY 'S M U S I N G S