IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544975
22 I-CONNECT007 MAGAZINE I MAY 2026 T RO U B L E I N YO U R TA N K T echnology trends shaping the electron- ics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)— are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncom- mon for designers to specify the organic solder- ability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding. This is essentially a process of selective surface finishing. The OSP is particularly useful for fine-pitch BGAs with pitches below 1.0 mm. In addition, the solder joint formed with an OSP finish is quite strong, as the tin in the solder forms a direct intermetallic bond with the copper. BY M I C H A E L CA R A N O, G LO BA L E L ECT RO N I C S AS S O C I AT I O N The Role of Organic Solderability Preservatives in Advanced Packaging