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Editor's note: This paper was first presented at IMPACT 2025 in Taiwan. The continuous push toward higher func- tionality, miniaturization, and performance in mod- ern electronic devices—such as smartphones, wear- ables, and advanced computing platforms—has intensified the demand for high-density interconnect (HDI) printed circuit boards. Central to HDI perfor- mance is the reliable formation of blind microvias (BMVs), which serve as critical interlayer connec- tions in modified semi-additive processes (mSAP). Innovative Flash Copper Plating Technology For Enhanced mSAP Via Reliability, HDI Manufacturing Efficiency, and Advanced Production Control A RT I C L E BY A N D R E AS S C H ATZ A N D M U STA FA ÖZ KÖ K , M KS' ATOT EC H 40 I-CONNECT007 MAGAZINE I MAY 2026 As BMV geometries shrink and core materials become thinner (≤25 µm), conventional electro- lytic copper plating systems encounter significant challenges: achieving sufficient copper coverage inside the via while minimizing unwanted surface deposition that inhibits fine line/space (L/S) capa- bilities. Furthermore, inconsistencies arising from glass fiber protrusions, copper overhang, wedge formations, and drilling variability can negatively impact via reliability. To address these challenges, a newly developed electrolytic flash copper plating system introduces