IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544975
106 I-CONNECT007 MAGAZINE I MAY 2026 C O N N ECT T H E D OTS BY M AT T ST E V E N S O N , AS C S U N STO N E C I RC U I TS T he rapid advance of technology is driving changes in electronics that require increas- ingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to pro- duce ultra high density interconnect (UHDI) PCBs, so it's important to tune our production capabilities and customer service models to this trend. Non- conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs. Not all PCB manufacturers approach NCVF in the same manner. Designers who thoroughly under- stand the process will have more confidence that their designs will be manufactured to meet re- quirements. What Designers Should Know About Non-conductive Via Fill