IPC International Community magazine an association member publication
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28 I-CONNECT007 MAGAZINE I MAY 2026 The increasing power and complexity of electronics systems are intensifying the demands on printed circuit boards and IC substrates. Ap- plications that include AI infrastructure, high- performance computing, electric vehicles, and next-generation consumer electronics require higher interconnect density and uncompromising reliability. At the same time, PCB fabricators are navigating a manufacturing environment shaped by supply chain volatility, sustainability mandates, and ongoing cost constraints. These forces prompt a broader reassessment of fabrication processes, particularly primary met- allization, a critical step that directly influences reliability, yield, environmental impact, and opera- tional resilience. For decades, electroless copper plating has been the industry standard for primary metalliza- tion. However, as high-density interconnect (HDI) complexity increases and sustainability Direct Metallization A Strategic Enabler for Advanced PCB Manufacturing BY CARMICHAEL GUGLIOTTI, MACDERMID ALPHA ELECTRONICS SOLUTIONS F E AT U R E A RT I C L E