I-Connect007 Magazine

6 I-CONNECT007 MAGAZINE I MAY 2026 Features Beyond Design 82 How Signals Survive the Hostile PCB Environment by Barry Olney Target Condition 94 The Modern Masters of Signal Integrity and AI-driven Design by Kelly Dack 100 Common vs. Differential Mode in Routing and Signal Integrity by Kristin Moyer Elementary, Mr. Watson 102 Controlled Impedance: When Connecting the Dots Stops Working by John Watson Articles 90 A Necessary Shift From Gerber to IPC-2581 by Tracy Riggan Columns Connect the Dots 106 What Designers Should Know About Non-conductive Via Fill by Matt Stevenson 70 116 122 123 In Every Issue MilAero007 Highlights Career Opportunities Educational Resources Advertiser Index 93 105 Shorts Reliability by Design: Aligning Intent With Fabrication Reality Below the Surface Looking Ahead to Where Integration Actually Happens by Chandra Gupta PCB007 Columns Trouble in Your Tank 22 The Role of Organic Solderability Preservatives (OSP) in Advanced Packaging by Michael Carano Happy's Tech Talk #48 34 Digital Twins: Integrating Design and Manufacturing by Happy Holden American Made Advocacy 72 Five Years of Educating, Advocating, and Influencing Legislation and Policy by Shane Whiteside APRIL 2026 Mastering Return Path Discontinuities for Robust Signal Integrity by Stephen Chavez 112 MAY 2026

• I-Connect007 Magazine — May 2026: Additive & Signal Integrity
• PCB007 Content
• Design007 Content
• Marcy's Musings: Additive Processes, Signal Consequences
• The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps
• Feature Interview: Rewriting Metallization One Ink at a Time
• Inkjet Solder Mask: Notion Systems Takes the Mic
• Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging
• Feature Article: Direct Metallization A Strategic Enabler for Advanced PCB Manufacturing
• Happy's Tech Talk #48: Digital Twins Integrating Design and Manufacturing
• Article: Innovative Flash Copper Plating Technology
• Feature Article: The AI Tipping Point Transforming Global Material Supply Chains
• Article: From Dilution to ZLD Optimizing Used Process Water Management
• Tariff Terminal: How New Metals Tariffs Impact the Electronics Industry
• Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
• UHDI Fundamentals: Manufacturing Readiness and Scaling Flex-Packaging Integration
• Rethinking Reinforcement Materials for Advanced Packaging
• Mil/Aero007
• American Made Advocacy: Five Years of Educating, Advocating, and Influencing Legislation and Policy
• Article: Don't Buy AI, Learn It: A Fabricator's Guide to Getting Started
• Beyond Design: How Signals Survive the Hostile PCB Environment
• Feature Interview: A Necessary Shift From Gerber to IPC-2581
• Reliability by Design: Aligning Intent With Fabrication Reality
• Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
• Feature Article: Common vs. Differential Mode in Routing and Signal Integrity
• Elementary Mr. Watson: Controlled Impedance When 'Connecting the Dots' Stops Working
• Below the Surface: Looking Ahead to Where Integration Actually Happens
• Connect The Dots: What Designers Should Know About Non-conductive Via Fill
• Feature Article: Mastering Return Path Discontinuities for Robust Signal Integrity
• I-007e Educational Resources
• Masthead and Advertiser Index