IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1544975
10 I-CONNECT007 MAGAZINE I MAY 2026 Electroninks offers insight into complex metal inks and discusses how his company is rethinking ma- terials at the molecular level. Carmichael Gugliotto of MacDermid Alpha Elec- tronics Solutions writes about the importance of direct metallization as a key enabler of advanced PCB manufacturing. He cites the growing demands placed on PCBs and substrates used in AI infra- structure and high-performance computing, where reliability and performance margins are increas- ingly tight. The engineering team at MKS' Atotech addresses enhanced mSAP processes with a focus on microvia reliability, an area of critical concern in high density interconnect (HDI) designs, while also considering manufacturing efficiency. Notion Sys- tems rounds out the semi-additive discussion with its inkjet solder mask technology, highlighting how digital deposition methods can improve precision and flexibility in PCB production. Our Design007 contributors tackle the evolving challenges of signal integrity. Stephen V. Chavez writes about return-path discontinuities, while Kris- tin Moyer addresses common-mode and differen- tial-mode noise in routing and signal integrity, as well as strategies for ensuring signal survival in increasingly hostile electromagnetic environments. In his column, Barry Olney succinctly captures the shift in design philosophy: "Modern PCB design is no longer just about routing signals but about engineering transmission lines, maintaining continuous return paths, and managing resonant structures within multilayer boards." Columnist John Watson reinforces this perspective by urging designers to move beyond schematic-level think- ing and consider the electromagnetic fields sur- rounding traces, dispelling the notion that signal integrity is somehow "black magic." Meanwhile, Kelly Dack explores how AI-driven design tools are pushing boundaries, transforming signal integrity from a niche concern into a deci- sive factor in determining product success, and shares a list of PCB designers who have had the most influence on him and the industry. This issue also features a range of forward- looking discussions tied to advanced manufac- turing. Anaya Vardya focuses on integrating flex circuits into advanced packaging solutions. A new contributor, Flexiramics, introduces innovative ap- proaches to reinforcement materials for electronic packaging. Mike Carano contributes insights into the role of organic solderability preservatives (OSPs) in advanced packaging and where they provide the most value. Chandra Gupta of Remtec examines RF design and integration, emphasiz- ing that true performance gains often occur at the interfaces, where components either work in harmony or conflict. Additional design-focused content includes a conversation between Paul Cooke and Kelly Dack on designing for reliability, as well as Matt Stevenson's overview of conductive via fill and what designers need to understand. Tracy Riggan interviews the leaders of the IPC-2581 Consortium about progress toward replacing Gerber files with a more secure and comprehensive data standard. Happy Holden bridges the gap between design and fabrication by reviewing the growing role of digital twins, which integrate design and manu- facturing data to improve outcomes, particularly as access to experienced manufacturing experts declines. In PCB fabrication, Richard Nichols continues his ongoing exploration of zero liquid discharge. We spotlight a roundtable discussion on cybersecurity and CMMC certification, and I explore the implications of the e-glass shortage in the AI era. Together, these perspectives highlight, once again, that our industry is in transition, where inno- vation in materials, processes, and design meth- odologies is essential to meeting the demands of increasingly complex electronics systems. I-CONNECT007 Marcy LaRont is the managing editor of I-Connect007 Maga- zine and executive director of IPC Publishing Group. Marcy started her career in PCBs in 1993 and brings a wide array of business experience and perspective to I-Connect007. To contact Marcy, click here. M A RCY 'S M U S I N G S