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MAY 2026 I I-CONNECT007 MAGAZINE 47 Using this method, we analyzed 36 BMVs plated with both the legacy and upgraded flash pro- cesses. The results, summarized below and shown in Fig- ure 9, demonstrate a clear improvement in NCL values with the new system. These findings confirm that the upgraded flash plating enhances copper to copper bonding and im- proves the mechanical reliability of the plated vias. Conclusion The newly developed electrolytic flash copper plating system represents a major technological advancement in HDI and mSAP PCB manufacturing. It delivers exceptionally uniform copper distribution while minimizing surface buildup, ensuring consis- tent layer quality even in demanding designs. The system significantly strengthens BMV structures, re- liably compensating for severe drilling defects and enhancing overall reliability. Its optimized crystal Figure 8: Used evaluation framework to determine NCL values. TABLE 1: DESCRIPTION OF NCL NUMBERS structure promotes superior metallurgical bonding, further improving long term performance. In addition, the technology introduces major improvements in particle control, resulting in higher yield stability and more predictable production outcomes. Enhanced transport precision supports the handling of ultra thin cores with greater accu- racy and reduced risk. Beyond performance gains, the system also lowers chemical, water, and energy consumption, making the process more sustainable. Together, these advancements provide a substantial reduction in total cost of ownership and establish a new benchmark for next generation PCB fabrication. Building on a POR already regarded as best-in- class, this upgraded system further advances uni- formity, L/S capability, and sustainability. It provides PCB manufacturers with a robust, scalable solution tailored to the stringent demands of next-genera- tion electronics. I-CONNECT007 References 1. "Innovative Flash Copper Plating Technology for Enhanced mSAP Via Reliability, HDI Manufacturing Efficiency, and Advanced Production Control," by M. Özkök, A. Özkök, T. Sponholz, H. Hübner, A. Schatz, P. Brooks, IMPACT Conference 2025, Taipei, Taiwan. Andreas Schatz is global product manager equip- ment electronics, and Mustafa Özkök is global product manager, advanced electronic plating solutions, for MKS' Atotech. Figure 9: Results of NCL for POR vs. the new flash process. Figure 10: Horizontal desmear, electroless copper deposition, and electrolytic copper plating line featuring next-generation horizontal copper plating technology. NCL Result Degree of epitaxy Risk 1 ≤ NCL ≤ 1.3 Low degree of epitaxy Potentially high risk of cracks 1.3 < NCL ≤ 1.5 Medium degree of epitaxy Potentially medium risk of cracks 1.5 < NCL High degree of epitaxy Potentially low risk of cracks Andreas Schatz Mustafa Özkök