Design007 Magazine

Design007-Jun2024

Issue link: https://iconnect007.uberflip.com/i/1522071

Contents of this Issue

Navigation

Page 18 of 75

Enable 800GbE Ethernet Speed with EM-892K and EM-892K2 Materials Industry's First Halogen-free Extreme Low Loss (ELL) Laminates IST Test: Pass Room temperature to 150°C for 3K Cycles with 32L 0.6mm hole pitch Advanced Foil Availability: Both HVLP3 and HVLP4 are compatible with "Glicap" non-etch oxide treatment Hybrid Compatibility: Fully compatible with EM-370(Z) (Mid. Loss) material for cost reduction and pass LF-260 10X with 32L 0.6mm hole pitch Key Material Features: EM-892K @70%RC: Dk: 2.84/ Df: 0.0017 @10GHz EM-892K2 @70%RC: Dk: 2.76/ Df: 0.0013 @10GHz with Cavity Resonator Method Anti-CAF Test: Pass 100V/ 85°C/ 85% RH with 32L 0.6mm hole pitch for 1K Hours Lead-Free Soldering Test: PASS LF-260°C/ 10X with 32L 0.6mm hole pitch www.emctw.com | EMC.INFS@mail.emctw.com North American Master Distributor (949) 587-3200 • insulectro.com

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Jun2024