Design007 Magazine

IPC invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for IPC APEX EXPO 2025. CALL FOR PARTICIPATION TECHNICAL TOPICS / / ADVANCED PACKAGING/COMPONENTS / ASSEMBLY & TEST PROCESSES / DESIGN / ELECTRONIC ASSEMBLY MATERIALS / EMERGING TECHNOLOGIES / FACTORY OF THE FUTURE / HDI, μHDI AND SUBSTRATES / PCB FABRICATION AND MATERIALS / POWER ELECTRONICS / QUALITY & RELIABILITY / SUSTAINABILITY FOR ELECTRONICS Technical Conference Abstracts and Professional Development Course Abstracts Due September 6, 2024. Conference Poster Abstracts Due October 4, 2024. IPCAPEXEXPO.ORG \ #IPCAPEXEXPO

• Design007 Magazine — Collaboration Culture
• Feature Contents — Creating a Culture of ollaboration
• Addtitional Contents
• Column — All Together Now: The Value of Collaboration
• Short — Book Excerpt: The Printed Circuit Assembler's Guide to…Encapsulating Sustainability for Electronics
• Feature Interview — The Collaboration Culture
• Short — Researchers Develop High-energy-density Aqueous Battery
• Feature Interview — Collaboration Station
• Short — Governments Struggling With 'Silicon-to-Systems Approach'
• Feature Article — Collaboration in PCB Design: Enhancing Innovation and Efficiency
• Feature Column — Termination Planning
• Feature Interview — A Great Recipe: Collaboration, Motivation, and Design Classes
• MilAero007 Highlights
• Feature Interview — Do You Collaborate With Your Component Supplier?
• Column — Artificial Intelligence in PCB Design
• Short — Disorder Improves Battery Life
• Column — Designing for Reality: Lamination and Materials
• UHDI Fundamentals: UHDI Applications for Medical Devices
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
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