PCB007 Magazine

16 PCB007 MAGAZINE I JUNE 2024 Feature Interview by Marcy LaRont I-CONNECT007 As our industry rallies around the call to action for HDI and UHDI, we find unparal- leled and myriad laminate options. is abun- dance is rivaled only by the question surround- ing them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent develop- ments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impend- ing "glassless revolution" and how it's poised to solve some of our manufacturing challenges. Marcy LaRont: Alun, can you explain glassless epoxy filler? Is it liquid? Alun Morgan: It's not liquid; it's a rubber-like Beyond Prepreg: The 'Glassless Revolution'

• Cover
• Featured Content — Materials Management
• Additional Content
• Column — All Things Material
• Feature Interview — The Critical Role of Materials
• Feature Interview — Beyond Prepreg: The 'Glassless Revolution'
• Feature Column — Materials for PWB Fabrication: Drillability and Metallization
• Feature Interview — Non-RF High-Speed Materials Continue to Advance
• Short — An Ink for 3D-printing Flexible Devices Without Mechanical Joints
• Interview — Overcoming Workforce Challenges from Onboarding to Upskilling
• Short — Lighting Up the Future
• Interview — Shane Whiteside Appointed as New PCBAA Chair
• Feature Article — Expansion and Growth: You Can't Do It Alone
• Short — Quantum Breakthrough: Engineering the World's Purest Silicon
• MilAero007 Highlights
• Column — Changing Leadership and Three Years of Advocacy in D.C.
• Feature Article — Building Resilient Supply Chains
• Short — How a Tiny Device Could Lead to Big Physics Discoveries and Better Lasers
• Feature Column — Chemical and Equipment Control of High-density Circuits
• Short — A New, Low-cost, High-efficiency Photonic Integrated Circuit
• Interview — Tom Edman Leads IPC Board of Directors
• Feature Article — Mustaches and Automation in Flexible PCB Fabrication
• Article — Pushing the Limits of PCB Impedance Control
• Column — The Analog Computer
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
• Problems Solved — Subscribe to Our Magazines