pro-bond &
thermal-bond
Flexible bondply materials for
high-performance, high-reliability
multilayer PCB stack-ups.
The Ventec range of pro-bond and thermal-bond bondply dielectrics
are formulated for high-speed signal integrity with low losses and
thermal management in ML PCB stack ups, needed for cutting-edge
computing and networking applications such as high layer count
multilayers, high-performance motherboards and server
backplanes and cellular network power amplifiers.
Contact your local sales representative today!
venteclaminates.com
Visit us at Booth 4116
18-20th March 2025
