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pro-bond & thermal-bond Flexible bondply materials for high-performance, high-reliability multilayer PCB stack-ups. The Ventec range of pro-bond and thermal-bond bondply dielectrics are formulated for high-speed signal integrity with low losses and thermal management in ML PCB stack ups, needed for cutting-edge computing and networking applications such as high layer count multilayers, high-performance motherboards and server backplanes and cellular network power amplifiers. Contact your local sales representative today! venteclaminates.com Visit us at Booth 4116 18-20th March 2025

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