IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1533344
IPC COMMUNITY 44 SPRING 2025 Standards Update Newly Published Standards and Revisions IPC-1602A Standard for Printed Board Handling and Storage The industry's sole standard on the handling, packag- ing, and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, sol- derability degradation, ESD, and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling, and transport of product, as well as establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking. IPC-7095E Design and Assembly Process Guidance for Ball Grid Arrays (BGAs) IPC-7095E describes design and assembly implemen- tation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides valuable and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions of how to successfully imple- ment robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can ccur during BGA assembly. IPC-8401 Guidelines for In-Mold Electronics IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candi- date materials, and production test methods. In-mold electronics integrate printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart molded structure. IME tech- nology uses mass production processes, materials, and components. IME parts are structural electronics char- acterized by their light weight, thinness, robustness, and seamless integration. IPC-2294 Design Standard for Printed Electronics on Rigid Substrates IPC-2294 establishes specific requirements for designing printed electronics applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294, are those that are not required to be flexed into a new shape for the purposes of assem- bly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconduc- tive, or nonconductive. IPC-6904 Qualification and Performance Specification for Printed Electronics on Rigid Substrates IPC-6904 establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and intercon- necting structures on rigid substrates. The substrate can be conductive, semiconductive, or nonconductive. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status