I-Connect007 Magazine

I007-MAY-2026

IPC International Community magazine an association member publication

Issue link: https://iconnect007.uberflip.com/i/1544975

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48 I-CONNECT007 MAGAZINE I MAY 2026 F E AT U R E A RT I C L E While the AI revolution has the world focused on the promise of solving our most complex challenges, some laminate and PCB fabricators are raising concerns that the high-per- formance materials used to build AI data centers will gobble up the precious resources needed to produce them. PCB industry expert Mark Goodwin, COO of Ventec International, is among a growing handful of suppliers who have been vocal in expressing their concerns about the critical shortage of glass and copper, which they believe will only get worse. Mark has specifically emphasized that copper-clad laminates (CCLs), the foundational substrate for The AI Tipping Point Transforming Global Material Supply Chains BY M A RCY L A RO N T, I - C O N N ECT 0 07

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