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REAL TIME WITH... IPC APEX EXPO 2024 SHOW & TELL MAGAZINE I I-CONNECT007 47 Europe, China, Korea, India, and Malaysia. AT&S showed that their growth is predomi- nately in four areas: 1. High-performance computing: IC and chiplets will grow to one trillion transistors by 2030 and power centers need nearly 500 MW of power. 2. Increase in speed: Higher speeds and low latency for 6G communications require new materials and lower losses for conductors. 3. Power efficiencies: EVs and other prod- ucts will be using 400 to 1200 volts at many hundreds of amps requiring special conduc- tors and heat dissipation. 4. Substrates vs. PCBs: Increasingly, this new level of substrates will be needed to handle these requirements between the printed circuit and the IC packaging components. AI and modeling will be needed for design, along with digi- tal twin, to meet the performance requirements for the future. The second presentation was from Resonac (formerly Showa Denka) of Japan and its focus on materials for IC packaging. They are developing advanced products for: 1. Dry film photoresist: Down to 2/2-micron T/S 2. Core materials: Includes novel resins with low CTE performance 3. Solder resist: Higher modulus for smaller vias and superior crack resistance 4. Glass: Perfecting copper adhe- sion to glass and lower temperature curing properties with panels up to 515 mm x 510 mm The final presentation was from Dai Nippon Processing (DNP) of Japan which is devel- oping various UHDI processes for advanced IC and heterogenous integration packaging. Much of their research is focused on model- ing substrates for high-frequency transmis- sions using glass as a substrate. The various technologies that must be embraced by DNP in via generation, metallization, lamination, and panel processing are significant and may take a consortium to carry out on time. S&T Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard, NanYa Westwood, Merix, Foxconn, and Gen- tex. He is currently a contributing technical editor and columnist for with I-Connect007, and the author of Automation and Advanced Procedures in PCB Fabrication, and 24 Essen- tial Skills for Engineers. To read his columns, click here. Hannes Voraberger of AT&S.