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54 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2024 SHOW & TELL MAGAZINE by Nolan Johnson • I-Connect007 C ongratulations to the authors of the Best Technical Conference Papers of the ECWC16 Technical Confer- ence at IPC APEX EXPO 2024, who were voted on through a ballot process by members of the IPC APEX EXPO Technical Conference Program Committee (TPC). The authors were recognized during the show's opening remarks on Tuesday, April 9. "All of the papers making up the ECWC16 Technical Conference at IPC APEX EXPO 2024 represent the highest quality technical con- tent from authors around the world," said Stan Rak, co-chair of the TPC. "The global diversity of the presenting authors increased this year because of the large Asian group affiliated with the World Electronic Circuits Council (WECC). A conference-high 28 abstracts were received in total from next- generation authors as well as seven student contributions, thus demonstrating the Confer- ence's ability to reach early career profession- als. However, there is still a vast amount of experience taking stage with more than 25% of the presenting authors holding doctoral degrees." Gary Brist and Neil Hubble Gary Brist, principal engineer-PCB tech- nology and applications at Intel, with co- author Neil Hubble, president of Akrometrix, received top honors for their technical paper, "Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs." In this interview, Neil discusses his study, which delves into local topography changes Best Technical Conference Papers Gary Brist Neil Hubble Neil's Interview