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134 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2024 SHOW & TELL MAGAZINE by Tracy Riggan • IPC Electric vehicle electronics suppliers of all types gathered Thursday, April 11, for the EV Electronics Special Session, which focused on design, manufacturing, and reliabil- ity challenges. The day's program, chaired by Dr. Stanton Rak of SF Rak Company, included two topical panels selected by a Technical Program Committee of EV industry experts. The first panel, "PCBA Reliability and Test for EV Applications," was moderated by Todd MacFadden, senior technology develop- ment project manager at Bose Corporation and co-chair of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards–Automotive Addendum. Bob Neves of MicroTek discussed how new high-voltage testing requirements present unique failure mechanisms, stressing the value of testing for reliability versus robustness. Dr. Lothar Henneken of Robert Bosch GmbH, contin- ued on that theme by discussing high-volt- age failure mechanisms. New manufacturing methods and materials were addressed by Dave Sbiroli of Indium (solder and Agsinter- ing material and process reliability), and Dr. Olaf Schoenfeld of Zestron (insulation coordination). The second panel, "EV Power Electronics Design and Manufacturability," was mod- erated by Dr. Udo Welzel, senior expert at Robert Bosch GmbH and chair of the Auto- motive Addendum to IPC J-STD-001G, Lowering EV Costs and Improving Quality Technical Session: Electric Vehicles